Microelectronic packaging, applied electromagnetics, and related areas including signal processing and applied mathematics. Simulation of physical and technological systems. Forward and inverse modeling and development of algorithms. Prototyping of proof-of-concept test vehicles. Microwave metrology.
Most Important Publication:
H. Braunisch, J.E. Jaussi, J.A. Mix, M.B. Trobough, B.D. Horine, V. Prokofiev, D. Lu, R. Baskaran, P.C. H. Meier, D.-H. Han, K.E. Mallory, and M.W. Leddige, "High-speed flex-circuit chip-to-chip interconnects," IEEE Trans. Adv. Packag., vol. 31, no. 1, pp. 82-90, Feb. 2008.
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